Multi-wire saw

DZ4-2-7316APQ-RS

Category:

Mainly used for cutting various hard and brittle materials into slices, such as gemstones, crystals, monocrystalline silicon, and magnetic materials.

Product Introduction

Primarily used for slicing various hard and brittle materials such as gemstones, crystals, monocrystalline silicon, and magnetic materials

Product features

Utilizing a dual-station configuration, it can cut two plates simultaneously.

The cutting chamber uses an electric lift structure, with three sides open for easy operation and maintenance.

Product parameters

Equipment	Product Model	DZ4-2-7316APQ-RS
	Number of Workstations	2
	Number of Spindles	4
	Roller Center Distance	307
	Material Plate Size (Length × Width × Height)	730 × 155 × 19 mm
	Workpiece Size (Length × Width × Height)	730 × 155 × 160 mm
	Roller Outer Diameter × Rubber Coating Length	Φ147 mm × 730 mm
	Cutting Type	Water-based/Oil-based Cutting Fluid
	Human-Machine Interface Size	10"
	Equipment Size (Length × Width × Height)	2450 × 2640 × 2700 mm (Operating) 3120 × 1731 × 2700 mm (Shipping)
	Motor Cooling Method	Forced Air Cooling
	Total Weight	≈8000 KG
Electrical	Power Supply	Three-phase four-wire AC380V 50Hz
	Total Power	≈55 KW
	Spindle	7.5 KW × 4
	Wire Feeding/Rewinding	5.5 KW × 2
	Tension	2.3 KW × 2
	Lifting	0.75 KW × 1
	Wire Discharge	0.40 KW × 2
	Horizontal Movement	-
	Swing	-
	Air Source	≥0.4 MPa
	Cutting System	XINJE
Performance	Cutting Accuracy	±0.02 mm
	Wire Diameter	Ф0.10-0.25 mm
	Wire Storage Capacity	Max 30KM (Ф0.25mm)
	Set Tension	Max 40N
	Lifting Stroke	250 mm
	Horizontal Movement Stroke	-
	Feed Rate	0.1-99.9 mm/min
	Wire Speed	Max 1000 m/min
	Cutting Method	Vertical Upward Feed
	Adjustable Angle of the Adjustment Table	5°
	Swing Angle	-