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Multi-wire saw

DZ4-2-5313AHQ-RS

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Mainly used for cutting various hard and brittle materials such as gemstones, crystals, single crystal silicon, and magnetic materials into slices and wafers

+8619803151250

yuzhenpeng@bokejinghui.com

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Product Introduction

Primarily used for cutting various hard and brittle materials into slices and wafers, such as gemstones, crystals, monocrystalline silicon, and magnetic materials

Product features

Utilizing a dual-station configuration, it can cut two plates simultaneously.

The machine body features a one-piece cast structure, offering high resistance to deformation and excellent vibration damping performance.

The guard adopts an electric lifting structure, with three sides open for easy operation and maintenance.

Product parameters

Equipment	Product Model	DZ4-2-5313AHQ-RS
	Number of Workstations	2
	Number of Spindles	4
	Roller Center Distance	282 mm
	Material Plate Size (Length × Width × Height)	530 × 130 × 20 mm
	Workpiece Size (Length × Width × Height)	530 × 130 × 150 mm
	Roller Outer Diameter × Rubber Coating Length	Φ140 mm × 530 mm
	Cutting Type	Water-based/Oil-based Cutting Fluid
	Human-Machine Interface Size	7"
	Equipment Size (Length × Width × Height)	2282 × 2310 × 2500 mm (Operating) 2952 × 1401 × 2700 mm (Shipping)
	Motor Cooling Method	Air Cooling
	Total Weight	≈3500 KG
Electrical	Power Supply	Three-phase four-wire AC380V 50Hz
	Total Power	≈25 KW
	Spindle	5.5 KW × 4
	Wire Feeding/Rewinding	3.0 KW × 2
	Tension	1.5 KW × 2
	Lifting	0.75 KW × 1
	Wire Discharge	0.40 KW × 2
	Horizontal Movement	0.40 KW × 1
	Swing	-
	Air Source	-
	Cutting System	XINJE
Performance	Cutting Accuracy	±0.02 mm
	Wire Diameter	Ф0.10-0.25 mm
	Wire Storage Capacity	Max 20KM (Ф0.25mm)
	Set Tension	Max 30N
	Lifting Stroke	240 mm
	Horizontal Movement Stroke	100 mm
	Feed Rate	0.1-99.9 mm/min
	Wire Speed	Max 800 m/min
	Stable Cutting Wire Speed	800 m/min
	Cutting Method	Vertical Upward Feed
	Adjustable Angle of the Adjustment Table	-
	Swing Angle	-